Rework Equipment Product List and Ranking from 18 Manufacturers, Suppliers and Companies

Last Updated：Sep 03, 2025 Aggregation Period:Aug 06, 2025～Sep 02, 2025
This ranking is based on the number of page views on our site.

Rework Equipment Manufacturer, Suppliers and Company Rankings

Last Updated：Sep 03, 2025 Aggregation Period:Aug 06, 2025～Sep 02, 2025
This ranking is based on the number of page views on our site.

ケイ・オール Tokyo//Manufacturing and processing contract
ビオラ Fukushima//Electronic Components and Semiconductors
デンオン機器 Tokyo//Industrial Electrical Equipment
4 ダイナテックプラス Chiba//Industrial Machinery
5 メイショウ Tokyo//Industrial Machinery

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Rework Equipment Product ranking

Last Updated：Sep 03, 2025 Aggregation Period:Aug 06, 2025～Sep 02, 2025
This ranking is based on the number of page views on our site.

"BGA Rework / BGA Reballing" *Available from just one unit! ビオラ
BGA rework with underfill ケイ・オール
Skill-less rework device MS9000SE II Series メイショウ
Rework System "RD-500S III" デンオン機器
4 Rework Station "ERSA HR550" ダイナテックプラス

Rework Equipment Product List

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Skill-less rework device MS9000SE II Series

BGA rework has become this easy! This rework device can handle BGA, CSP, and microchips all with one machine.

Achieving "skill-less" rework tasks with a wide variety of options. 1. Two models available (Semi-auto / Auto) 2. Features of "skill-less" - Three points (1) Automatic acquisition of temperature profiles It is possible to acquire temperature profiles while removing components. Rework tasks can be performed even without sample boards. (2) Alignment function (Pattern matching / Visual move) A unique feature that allows easy alignment of boards and components with just a click. Patent obtained. (3) Solder cleaning The device's heater provides heating power that cannot be achieved with hand tools, absorbing and removing melted solder. This enables stable cleaning tasks in a short time. 3. Flexible "function expansion" Support for switching to IR method, chip unit capable of handling small chip components, solder cleaning unit, and a high-resolution external camera capable of capturing still images and videos. 4. Balancing precision within 20μm and ease of use 5. Complete in-house development and manufacturing Development and manufacturing are consistently carried out in our domestic factory, allowing us to meet various customer demands.

Company：メイショウ
Price：Other

Other mounting machines

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LGA implementation and rework

We propose proper implementation regarding LGA! We also accept rework tasks in case of defects.

At Kei All, we can utilize our achievements and experience with LGA just like we do with BGA, allowing us to perform removal, installation, replacement, and modification. However, BGA and LGA are similar yet distinct, and it is precisely because we understand the characteristics of LGA that we can carry out rework tasks. If you are experiencing issues such as "frequent shorts in LGA assembly" or "wanting to reball LGA to convert it to BGA," please feel free to consult with us. If you have any problems with LGA, we will resolve them using our past achievements and know-how. 【Features】 ■ Addressing various issues with reliable technology ■ Rework capability allows for recovery in case of emergencies ■ Comprehensive inspection, starting with the first board, followed by the assembly and rework of the remaining boards *For more details, please refer to the PDF document or feel free to contact us.

Company：ケイ・オール
Price：Other

Contract manufacturing

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BGA rework with underfill

Advanced rework technology! It prevents the concentration of stress that occurs on the connection surface of solder balls.

BGA is mounted on the printed circuit board by solder balls. Due to weak connection strength, there may be cases where the reliability of the connection cannot be maintained due to the detachment of the BGA or the occurrence of cracks at the solder joints in response to external stresses such as impact or bending. To address such issues and improve connection reliability, a sealing resin called underfill is used in the gap between the component and the board. 【Features】 ■ Uses a one-component heat-curing epoxy resin ■ Can reduce external stresses ■ Prevents concentration of stress at the connection surfaces of the solder balls ■ Widely used in mobile devices such as mobile phones and music players *For more details, please refer to the PDF document or feel free to contact us.

Company：ケイ・オール
Price：Other

Contract manufacturing

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POP implementation and rework

Proposal based on the concept of new POP implementation! It can reduce the package footprint after implementation.

POP (Package On Package) is a technology that increases integration density by stacking IC packages that were previously arranged in a two-dimensional layout on a circuit board. It is primarily used in industries that manufacture mobile devices such as mobile phones, portable music players, and car navigation systems, where high-density implementation is required. By adopting a stacked structure for the packages, it allows for the combination of packages with different functions. 【Features】 ■ Reduces the occupied area of the package after implementation ■ Enables the combination of packages with different functions by using a stacked structure ■ Minimizes wiring between packages, reducing the impact of reflections and noise, and our company also supports POP configurations with three or more layers *For more details, please refer to the PDF materials or feel free to contact us.

Company：ケイ・オール
Price：Other

Contract manufacturing

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ERSA IR Rework System

The rework system developed by ERSA in Germany, born from years of experience. It overturns the concept that rework tasks are difficult!

With ERSA's unique dark IR heater, infrared radiation heating enables safer and more reliable rework of lead-free BGA and SMT. Since it does not use hot air, there are no temperature variations, and it does not affect surrounding components, allowing for precise component reinstallation and reballing. The dynamic IR and multi-closed loop eliminate the need for cumbersome profile generation, making it easy for anyone to operate with the included control software. This flagship model of the best-selling selective reflow is from ERSA, a German manufacturer specializing in solder-related equipment, which has over 80 years of experience and has supplied more than 4,000 IR rework devices worldwide.

Company：ダイナテックプラス
Price：Other

Soldering Equipment
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ERSA Hybrid Desktop Rework System

Germany's ERSA company offers a simple and compact high-performance rework system.

The unique hybrid heating method of ERSA allows for the benefits of mid-infrared heating to be maintained while enabling safe and easy rework of lead-free small SMD components on a tabletop. There is no scattering of the target components or adjacent components, which was a drawback of traditional blower methods, allowing for efficient heating of the substrate and components, and enabling work with minimal delta t. The ERSA HR100 not only allows for handheld heating like traditional blowers but also demonstrates its potential as a full-fledged rework system when combined with a bottom heater. Additionally, it can be connected via USB cable to the control software IRSoft for the ERSA rework system, enabling advanced system setups such as profile control and temperature measurement and management. The ERSA HR200 is a machine designed to be easy and safe for anyone to use, with operations and functions minimized. Its compact and lightweight body does not require specific installation locations or usage environments, making it highly effective in a wide range of settings.

Company：ダイナテックプラス
Price：Other

Soldering Equipment
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Rework device "ERSA HR600 /2"

The evolved version of the dark IR heater from Germany's ERSA company! Ultra-high efficiency rework device.

The "ERSA HR600 /2" is a model equipped with ERSA's proprietary hybrid infrared heater, capable of fully automating a series of operations for IC removal, alignment, and reinstallation. It has been newly introduced with a refreshed design! The "HR600 /2" now includes a function that automatically recognizes the lead pattern of the reworked IC and the board pattern through image processing, allowing for automatic installation. It supports all types of components, including BGA/CSP, QFP, QFN, and LGA. The entire operation of component mounting and reflow can be executed with a single click, and operations through paste printing fixtures or transfer fixtures can also be configured. 【Features】 ○ Fully automatic IC installation via image processing ○ Fully automatic IC removal/reflow control ○ Rapid cooling of the board using compressor air ○ 10 million pixel high-performance reflow observation camera & LED lighting ○ Board table with warpage prevention function For more details, please contact us or download the catalog.

Company：ダイナテックプラス
Price：Other

Soldering Equipment
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Rework Station "ERSA HR550"

Germany's ERSA company latest model! Integrated semi-automatic machine equipped with high-power dual hybrid.

The "ERSA HR550" is a semi-automatic machine equipped with ERSA's proprietary hybrid infrared heater, featuring an integrated mount module/reflow module. During component placement operations, the Computer Aided Component Placement (CAP) system uses image processing to display the connection points of components in red, the connection points of the circuit board in green, and when optimally aligned, in blue, allowing for precise component placement. Additionally, the newly developed software HRSoft 2, with its Enhanced Visual Assistant (EVA), clearly guides users through each step from profile selection to the soldering process, making it easy for anyone to follow. 【Features】 - The upper heater is a hybrid type (IR + convection air) with a 1,500W head. - The lower heater features a medium-wave IR heater panel with 2,400W when three zones are selected. - Enhanced Visual Assistant (EVA) provides clear instructions for work procedures. - Computer Aided Component Placement (CAP) enables accurate component placement. - The new platform HRSoft 2.

Company：ダイナテックプラス
Price：Other

Soldering Equipment
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Component assembly rework

We select the most suitable factory based on the implementation details in the array, so we can meet a wide range of requests.

BGA, CSP rework and reballing IC (SOP, QFN, QFP) Aerial wiring Jumper wiring, pattern cutting

Company：アレイ
Price：Other

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"BGA Rework / BGA Reballing" *Available from just one unit!

Over 50,000 rework achievements for BGA with a pitch of 0.35 to 1.27mm! Even for just one piece, you can trust us with circuit boards that have underfill applied!

Our company performs "BGA rework and reballing" using IPC-recommended IR rework equipment (7 units owned). We have a track record of reworking over 100,000 BGA components with pitches ranging from 0.35 to 1.27mm, as well as reballing over 50,000 BGA components with ball diameters from Φ0.2 to 0.76mm. We can also accommodate copper core balls. We can handle requests starting from just one piece, and we are capable of working on circuit boards with underfill applied, as well as replacing QFN and connector components. We can also address components that are difficult to replace. Please feel free to consult with us. 【Features】 ■ BGA and QFN Rework - Over 100,000 BGA rework achievements with pitches from 0.35 to 1.27mm - Achievements with 1,300 special QFN components - Capable of handling difficult-to-replace components - Analysis of soldering conditions using X-ray observation equipment with CT functionality ■ BGA Reballing - Over 50,000 reballing achievements for BGA components with ball diameters from Φ0.2 to 0.76mm - Capable of handling components with underfill applied - Can manage the entire process from BGA removal to reballing to rework *For more details, please refer to the PDF document or feel free to contact us.

Company：ビオラ
Price：Less than 10,000 yen

Soldering Equipment
Dedicated IC
Prototype Services

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[Information] Introduction to IR Method BGA Rework System

Detailed information about the BGA rework system with a global cumulative sales volume of 7,000 units.

This is an introduction document for the IR method BGA rework systems "IR550A" and "IR/PL650A" owned by Viola Corporation. It covers issues related to lead-free rework using hot air, comparisons between hot air methods and ERSA IR heaters during BGA rework, and various advantages of infrared heating. [Contents (excerpt)] ■ ERSA IR/PL IR Rework Station ■ Issues with lead-free rework using hot air ■ Comparison of hot air methods and ERSA IR heaters during BGA rework ■ Advanced technology from ERSA ■ RPC Reflow Observation Camera ■ Various advantages of infrared heating, etc. *For more details, please refer to the PDF document or feel free to contact us.

Company：ビオラ
Price：Other

Processing Contract
Other contract services

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BGA/SMT Rework Machine "RD-500III"

[Parts Repair/Repair/Reimplementation] Stable and safe rework operations, standard solder and lead-free solder, compatible with large and small circuit boards, large and small devices!

The "RD-500III" is a rework system that supports stable and safe rework operations, lead-free solder, eutectic solder, large substrates (up to 500×600mm), and various devices. The top heater and bottom heater utilize high-performance, high-efficiency high-power hot air heaters, ensuring stable and safe heating of the joints. 【Features】 ■ Flash memory controller → Does not require moving parts such as hard disks or cooling fans ■ Three heating systems optimal for lead-free applications ■ Two cooling modes tailored to the application ■ Two-point auto profile for device temperature control ■ Integrated functions from solder printing to device setting 【Applications】 - Tablets - Computer motherboards - Mobile phones - Smartphones - Wearables - BGA, CSP, POP, QFN, etc. *For more details, please request materials or view the PDF data available for download.

Company：デンオン機器
Price：Other

Other semiconductor manufacturing equipment
Other processing machines
Soldering Equipment

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Denon Equipment Co., Ltd. "PRODUCT GUIDE"

【Parts Repair/Repair/Reimplementation】A network that leaps into the world! We will make new proposals with new technology.

Denon Equipment Co., Ltd. engages in the development, manufacturing, and sales of soldering and desoldering system tools, as well as the development, design, manufacturing, sales, and import/export of audio and electronic equipment, and the design and construction of facilities. As a global company, we continuously expand our business activities with an international perspective and strive to strengthen our sales network overseas. We provide high-quality and reliable products through a sales and service network that can promptly respond to the needs of the global market. 【Products Offered】 ○ Rework Systems ○ Soldering Equipment ○ Solder Removal Tools ○ Preheaters, etc. For more details, please contact us or download the catalog.

Company：デンオン機器
Price：Other

Other heaters
Soldering Equipment
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Rework System "RD-500SV"

[Parts Repair/Repair/Reimplementation] All SMT components with this one machine! All-in-one rework system.

The "RD-500SV" is a rework system characterized by its multifunctionality and ease of use in profiling. Temperature management can be adjusted from the basic 5 zones to a maximum of 30 zones, allowing for individual settings for heating time, heater temperature, Z-axis height, buzzer sound, and the presence or absence of suction for each zone. Additionally, advanced profile settings can be handled with one click in Easy Select mode. It can flexibly accommodate packages with strict conditions, including standard BGA and POP. 【Features】 ○ All-in-one type (handles all SMT components with this one unit) ○ Easy Select mode (achieves simple operation for POP, QFN, and CHIP modes) ○ Wide compatibility from industrial large boards to small boards and 0402 components ○ Contactless cleaning ○ Equipped with unique safety features, operating simply and safely For more details, please contact us or download the catalog.

Company：デンオン機器
Price：Other

Circuit board processing machine
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Rework System "SD-3000II"

With the rework system for parts repair/repair/re-implementation! No failures with easy operation! SMT rework system using spot air method.

For rework systems, choose Denon equipment. The "SD-3000II" can handle the removal of various shapes such as QFP, SOP, BGA, and connector DIP without changing the nozzle head, and since it uses a non-contact method, there are no troubles. It has a built-in timer, allowing anyone to use it with confidence. The trace width of the nozzle in the X-Y direction can be set arbitrarily within the range of 0 to 50mm. 【Features】 ○ Supports all SMT up to 50mm square without changing the nozzle head ○ Can also remove connectors and other components ○ Employs a timer to prevent damage to the board and surrounding areas due to overheating ○ Automation with a microprocessor enables rework operations without failures ○ Lightweight and compact For more details, please contact us or download the catalog.

Company：デンオン機器
Price：Other

Circuit board processing machine
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